Inventor · disambiguated record
Yuichi Yato
Also filed as: YATO YUICHI
11 granted patents·2 pending applications·41 citations·filing 2008–2020
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0188US9607940B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 28, 2017·11 cites·20 claims
- 0283US8643185B2Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint materialKAJIWARA RYOICHI·Filed 2008·Granted Feb 4, 2014·13 cites·11 claims
- 0382US7977775B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 12, 2011·10 cites·15 claims
- 0479US11444010B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0569US10347567B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·10 claims
- 0665US9922905B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 20, 2018·1 cites·20 claims
- 0764US10037932B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 31, 2018·1 cites·10 claims
- 0864US9362238B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·1 cites·10 claims
- 0961US8252632B2Semiconductor device and manufacturing method of the sameYATO YUICHI·Filed 2011·Granted Aug 28, 2012·2 cites·6 claims
- 1052US9214412B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Dec 15, 2015·0 cites·20 claims
- 1143US2014264383A1Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1237US10818581B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·16 claims
- 1336US2013009300A1Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →