Inventor · disambiguated record
Yung-I Yeh
Also filed as: YEH YUNG I
31 granted patents·7 pending applications·527 citations·filing 1998–2025
97Inventor score
Top patents by PatentIndex Score
38 records- 0196US6528882B2Thermal enhanced ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·151 cites·18 claims
- 0295US8786060B2Semiconductor package integrated with conformal shield and antennaYEN HAN-CHEE·Filed 2012·Granted Jul 22, 2014·93 cites·18 claims
- 0393US9960137B1Semiconductor device package and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 1, 2018·11 cites·17 claims
- 0492US10593630B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Mar 17, 2020·8 cites·20 claims
- 0591US12364008B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 15, 2025·1 cites·9 claims
- 0687US11139252B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 5, 2021·2 cites·20 claims
- 0787US9484313B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 1, 2016·10 cites·14 claims
- 0886US11997888B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 28, 2024·1 cites·16 claims
- 0986US6291898B1Ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Sep 18, 2001·62 cites·9 claims
- 1085US9984983B2Semiconductor packages with thermal-enhanced conformal shielding and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 29, 2018·5 cites·23 claims
- 1185US6423622B1Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 23, 2002·40 cites·20 claims
- 1284US2025344505A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1383US6751781B2Thermal data automatic service systemADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 15, 2004·49 cites·20 claims
- 1481US11224132B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 11, 2022·2 cites·19 claims
- 1580US12089349B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 10, 2024·0 cites·15 claims
- 1676US10797022B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 1776US6489682B1Ball grid array semiconductor package and substrate thereforADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Dec 3, 2002·34 cites·5 claims
- 1874US11744024B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Aug 29, 2023·0 cites·14 claims
- 1966US6916732B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 12, 2005·11 cites·21 claims
- 2061US12218077B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 4, 2025·0 cites·16 claims
- 2161US11437415B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 6, 2022·0 cites·19 claims
- 2257US7375020B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 20, 2008·6 cites·10 claims
- 2355US11201200B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 14, 2021·0 cites·15 claims
- 2453US6960822B2Solder mask and structure of a substrateADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 1, 2005·5 cites·11 claims
- 2553US6551855B1Substrate strip and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Apr 22, 2003·5 cites·11 claims
- 2652US11081473B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·0 cites·21 claims
- 2751US6642612B2Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Nov 4, 2003·4 cites·20 claims
- 2849US6795746B2System for providing IC bonding diagram via networkADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 21, 2004·3 cites·11 claims
- 2948US5982625ASemiconductor packaging deviceADVANCED SEMICONDUCTOR ENG·Filed 1998·Granted Nov 9, 1999·15 cites·20 claims
- 3044US2021159188A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 3144US2020083132A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
- 3238US2004150099A1Cavity down MCM packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
- 3337US7061084B2Lead-bond type chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·0 cites·18 claims
- 3436US6313413B1Wire structure of substrate for layout detectionADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 6, 2001·7 cites·10 claims
- 3534US2002125570A1Ball grid array semiconductor package structure to avoid high frequency interferenceFiled 2001·Application pending·0 cites
- 3634US2002081771A1Flip chip processFiled 2001·Application pending·0 cites
- 3729US6252309B1Packaged semiconductor substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 26, 2001·0 cites·3 claims
- 3828US2001048999A1Reinforced flexible substrates and method thereforFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →