Inventor · disambiguated record

Yuan-Ping Yeh

Also filed as: YEH YUAN-PING

1 granted patent·5 pending applications·0 citations·filing 2023–2024

4Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD6

Top patents by PatentIndex Score

6 records

0156US2025385145A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0253US2025336794A1Package substrate and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0352US2025379130A1Package substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0450US2025132236A1Package substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0549US12469774B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·9 claims
0646US2024282689A1Electronic package, packaging substrate and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Yuan-Ping Yeh files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →