Inventor · disambiguated record
Yuan Zang
Also filed as: ZANG YUAN
3 granted patents·2 pending applications·19 citations·filing 2008–2017
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0188US8901721B1Lead frame based semiconductor die packageBAI ZHIGANG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 0286US10037935B1Lead frame with dummy leads for burr mitigation during encapsulationNXP USA INC·Filed 2017·Granted Jul 31, 2018·6 cites·20 claims
- 0361US9997445B2Substrate interconnections for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Jun 12, 2018·1 cites·8 claims
- 0443US2008283980A1Lead frame for semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 0539US2013249071A1Semiconductor device and method of assembling sameYAO JINZHONG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →