Inventor · disambiguated record
Yu Zhou
Also filed as: ZHOU YU · Zhou yu ting
38 granted patents·7 pending applications·62 citations·filing 2007–2025
96Inventor score
Files withYANGTZE MEMORY TECH CO LTD20AMAZON TECH INC7SUZHOU INST NANO TECH & NANO BIONICS SINANO CAS4WUHAN XINXIN SEMICONDUCTOR MFG4XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
45 records- 0196US11361988B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0295US11545388B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 3, 2023·2 cites·20 claims
- 0394US2025364318A1Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0493US10896844B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jan 19, 2021·5 cites·14 claims
- 0592US10658378B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 19, 2020·9 cites·20 claims
- 0691US11467946B1Breakpoints in neural network acceleratorAMAZON TECH INC·Filed 2019·Granted Oct 11, 2022·11 cites·17 claims
- 0791US10868031B2Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 15, 2020·5 cites·6 claims
- 0887US12406879B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0987US10937806B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 2, 2021·2 cites·20 claims
- 1084US10943853B2Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Mar 9, 2021·4 cites·20 claims
- 1184US10840419B2Nitride semiconductor light-emitting device and manufacture method thereforeSUZHOU INST NANO TECH & NANO BIONICS SINANO CAS·Filed 2017·Granted Nov 17, 2020·2 cites·14 claims
- 1284US2025280538A1Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 1383US11961760B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1481US10312409B2Patterned sapphire substrate, light emitting diode and fabrication method thereofXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2017·Granted Jun 4, 2019·3 cites·16 claims
- 1575US10910390B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 2, 2021·1 cites·20 claims
- 1672US11968832B2Multiple-stack three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 1772US11888052B2Semiconductor device and manufacturing method thereof employing an etching transition layerSUZHOU INST NANO TECH & NANO BIONICS SINANO CAS·Filed 2019·Granted Jan 30, 2024·2 cites·5 claims
- 1872US10997277B1Multinomial distribution on an integrated circuitAMAZON TECH INC·Filed 2019·Granted May 4, 2021·2 cites·20 claims
- 1972US10211367B2Light emitting diode and fabrication method thereofXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2017·Granted Feb 19, 2019·2 cites·20 claims
- 2071US11380701B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 2171US11362205B2Group III nitride enhancement-mode HEMT based on composite barrier layer structure and manufacturing method thereofSUZHOU INST NANO TECH & NANO BIONICS SINANO CAS·Filed 2018·Granted Jun 14, 2022·2 cites·8 claims
- 2271US11271004B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 8, 2022·0 cites·19 claims
- 2370US11211393B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·19 claims
- 2469US10529732B2Method for forming staircase structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·15 claims
- 2568US12210438B1Breakpoints in neural network acceleratorAMAZON TECH INC·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 2668US10884707B1Transpose operations using processing element arrayAMAZON TECH INC·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 2768US10651193B2Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·1 cites·22 claims
- 2866US11302715B2Three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 2964US7656991B2Image reconstruction method and X-ray CT apparatusGE MED SYS GLOBAL TECH CO LLC·Filed 2007·Granted Feb 2, 2010·4 cites·9 claims
- 3063US11347480B2Transpose operations using processing element arrayAMAZON TECH INC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 3159US10930662B2Method for forming staircase structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 23, 2021·0 cites·15 claims
- 3257US10892276B2Three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jan 12, 2021·0 cites·19 claims
- 3354US11748250B2Method and electronic device for data processing, and storage mediumBEIJING HORIZON ROBOTICS TECH RES & DEVELOPMENT CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·14 claims
- 3454US2024153911A1Method for forming semiconductor device and semiconductor device fabricated therebyWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 3552US12333950B2Unmanned aerial vehicle-aided over-the-air computing system based on full-duplex relay and trajectory and power optimization method thereofUNIV CHINA MINING·Filed 2023·Granted Jun 17, 2025·0 cites·6 claims
- 3651US12073199B2Reducing computation in neural networks using self-modifying codeAMAZON TECH INC·Filed 2019·Granted Aug 27, 2024·0 cites·13 claims
- 3751US2025077725A1Inerter finite element simulation method, software apparatus, electronic device, and storage mediumUNIV SHENZHEN·Filed 2024·Application pending·0 cites
- 3850US2024194531A1Three-dimensionally integrated structure and method for fabricating sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 3948US10558291B2Touch sensitive cover plate and manufacturing method thereof, and touch sensitive display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Feb 11, 2020·0 cites·20 claims
- 4047US2024186405A1High-electron-mobility transistor structure as well as fabricating method and use thereofSUZHOU INST NANO TECH & NANO BIONICS SINANO CAS·Filed 2022·Application pending·0 cites
- 4146US10929063B1Assisted indirect memory addressingAMAZON TECH INC·Filed 2019·Granted Feb 23, 2021·0 cites·21 claims
- 4243US8755486B2Method for placing A/D converter, front-lit detector and CT apparatusLIU ZHIQIANG·Filed 2011·Granted Jun 17, 2014·0 cites·17 claims
- 4343US2016381646A1Method and system for high density wi-fi communicationsLI QINGHUA·Filed 2013·Application pending·0 cites
- 4442US11043448B2Semiconductor device with vertically separated openings and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jun 22, 2021·0 cites·11 claims
- 4536US11954011B2Apparatus and method for executing customized artificial intelligence production lineBEIJING BAIDU NETCOM SCI & TECH CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Yu Zhou files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →