Inventor · disambiguated record
Zeki Z. Celik
Also filed as: CELIK ZEKI · CELIK ZEKI Z
4 granted patents·1 pending application·195 citations·filing 1996–2012
78Inventor score
Top patents by PatentIndex Score
5 records- 0192US6114761AThermally-enhanced flip chip IC package with extruded heatspreaderLSI LOGIC CORP·Filed 1998·Granted Sep 5, 2000·152 cites·10 claims
- 0287US7968999B2Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesiveLSI CORP·Filed 2008·Granted Jun 28, 2011·18 cites·23 claims
- 0359US8946871B2Thermal improvement of integrated circuit packagesLSI CORP·Filed 2012·Granted Feb 3, 2015·1 cites·20 claims
- 0455US5880377AMethod for low velocity measurement of fluid flowLSI LOGIC CORP·Filed 1996·Granted Mar 9, 1999·24 cites·8 claims
- 0546US2009030660A1Method and apparatus for generating fully detailed three-dimensional electronic package and pcb board modelsLSI LOGIC CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →