Inventor · disambiguated record
Ze Chen
Also filed as: CHEN ZE · CHEN ZE RUI
26 granted patents·5 pending applications·40 citations·filing 2011–2024
93Inventor score
Top patents by PatentIndex Score
31 records- 0190US9287391B2Semiconductor deviceCHEN ZE·Filed 2012·Granted Mar 15, 2016·9 cites·4 claims
- 0290US9041051B2Semiconductor deviceCHEN ZE·Filed 2011·Granted May 26, 2015·11 cites·4 claims
- 0388US12199192B1Trench Schottky barrier rectifier and method for fabricating sameDIODES INC·Filed 2024·Granted Jan 14, 2025·1 cites·21 claims
- 0481US12382683B2Semiconductor structure and method of fabricating the sameDIODES INC·Filed 2024·Granted Aug 5, 2025·0 cites·18 claims
- 0581US9640644B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 2, 2017·4 cites·6 claims
- 0681US9385183B2Semiconductor deviceCHEN ZE·Filed 2012·Granted Jul 5, 2016·6 cites·8 claims
- 0780US11227927B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jan 18, 2022·1 cites·16 claims
- 0879US12414341B2Method of fabricating a semiconductor structureDIODES INC·Filed 2023·Granted Sep 9, 2025·0 cites·4 claims
- 0976US8598622B2Semiconductor deviceSADAMATSU KOJI·Filed 2011·Granted Dec 3, 2013·6 cites·3 claims
- 1071US12218256B1Trench MOS rectifier with termination structureDIODES INC·Filed 2024·Granted Feb 4, 2025·0 cites·7 claims
- 1171US12170340B1Semiconductor rectifier and manufacturing method of the sameDIODES INC·Filed 2024·Granted Dec 17, 2024·0 cites·20 claims
- 1271US12002851B2Semiconductor structure and method of fabricating the sameDIODES INC·Filed 2022·Granted Jun 4, 2024·0 cites·19 claims
- 1371US2025151298A1Method of manufacturing a trench mos rectifier with a termination structureDIODES INC·Filed 2024·Application pending·0 cites
- 1468US9508792B2Semiconductor device including an electric field buffer layer and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Nov 29, 2016·2 cites·19 claims
- 1567US2025015199A1Semiconductor rectifierDIODES INC·Filed 2024·Application pending·0 cites
- 1665US10903312B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 26, 2021·0 cites·7 claims
- 1761US2025176200A1Semiconductor Structure and Manufacturing Method ThereofDIODES INC·Filed 2024·Application pending·0 cites
- 1859US11545564B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 3, 2023·0 cites·12 claims
- 1957US11695065B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jul 4, 2023·0 cites·19 claims
- 2056US2017301753A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Application pending·0 cites
- 2155US9735229B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 15, 2017·0 cites·8 claims
- 2253US11574998B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Feb 7, 2023·0 cites·14 claims
- 2349US11824084B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 21, 2023·0 cites·7 claims
- 2448US9640643B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted May 2, 2017·0 cites·3 claims
- 2545US11444156B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Sep 13, 2022·0 cites·5 claims
- 2645US11004932B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 11, 2021·0 cites·8 claims
- 2745US10861932B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 2843US10872959B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Dec 22, 2020·0 cites·8 claims
- 2938US10529840B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 7, 2020·0 cites·5 claims
- 3033US2017154955A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Application pending·0 cites
- 3132US9246019B2High efficiency rectifierRILEY LEE SPENCER·Filed 2011·Granted Jan 26, 2016·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →