Inventor · disambiguated record
Zeev Lipkes
Also filed as: LIPKES ZEEV
3 granted patents·192 citations·filing 1983–1997
75Inventor score
Top patents by PatentIndex Score
3 records- 0190US4611238AIntegrated circuit package incorporating low-stress omnidirectional heat sinkBURROUGHS CORP·Filed 1985·Granted Sep 9, 1986·124 cites·11 claims
- 0282US5945902ACore and coil structure and method of making the sameLIPKES ZEEV·Filed 1997·Granted Aug 31, 1999·65 cites·21 claims
- 0330US4485958ATool for removing soldered IC packagesBURROUGHS CORP·Filed 1983·Granted Dec 4, 1984·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →