Inventor · disambiguated record
Zewei Wang
Also filed as: WANG ZEWEI
1 granted patent·5 pending applications·0 citations·filing 2023–2024
12Inventor score
Files withINTEL CORP3CARRIER CORP1GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD1SHENZHEN JIACHEN PLASTIC HARDWARE ELECTRONICS CO LTD1
Top patents by PatentIndex Score
6 records- 0150US2025106994A1Three ball second level interconnect package architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0248US2025006691A1Compliant inserts for pin dipping processesINTEL CORP·Filed 2023·Application pending·0 cites
- 0347US2025064227A1Accessory bracket and display cabinetCARRIER CORP·Filed 2024·Application pending·0 cites
- 0445US2024077596A1Distance measuring method, distance measuring apparatus, electronic device, and non-transitory computer readable storage mediumGUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD·Filed 2023·Application pending·0 cites
- 0542US2024304473A1Methods and apparatus to place balls for second level interconnects of integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0630USD1104608SWarming plateSHENZHEN JIACHEN PLASTIC HARDWARE ELECTRONICS CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →