Inventor · disambiguated record

Zelong Yu

Also filed as: YU ZELONG

0 granted patents·3 pending applications·0 citations·filing 2023–2024

Technology areasH10W

Files withSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD3

Top patents by PatentIndex Score

3 records

0154US2025279394A1Bridge chip, fan-out package structure and corresponding packaging methodSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
0251US2024363601A1Chip package structure and preparation method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2024·Application pending·0 cites
0351US2024006370A1Chip package with heat dissipation plate and manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →