Inventor · disambiguated record
Zhaoqing Chen
Also filed as: CHEN ZHAOQING
26 granted patents·3 pending applications·162 citations·filing 1999–2018
95Inventor score
Top patents by PatentIndex Score
29 records- 0196US7335976B2Crosstalk reduction in electrical interconnects using differential signalingIBM·Filed 2005·Granted Feb 26, 2008·95 cites·12 claims
- 0285US7465882B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2006·Granted Dec 16, 2008·10 cites·5 claims
- 0378US9600619B2Distribution of power vias in a multi-layer circuit boardIBM·Filed 2015·Granted Mar 21, 2017·2 cites·7 claims
- 0478US9543241B2Interconnect array pattern with a 3:1 signal-to-ground ratioIBM·Filed 2014·Granted Jan 10, 2017·3 cites·14 claims
- 0577US9646925B2Interconnect array pattern with a 3:1 signal-to-ground ratioIBM·Filed 2015·Granted May 9, 2017·2 cites·9 claims
- 0676US9984189B2Data clocked retimer modelIBM·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 0774US9712315B1Reference clocked retimer modelIBM·Filed 2016·Granted Jul 18, 2017·2 cites·16 claims
- 0874US7939930B2Crosstalk reduction in electrical interconnects using differential signalingIBM·Filed 2007·Granted May 10, 2011·5 cites·5 claims
- 0972US10530422B2Behavioural circuit jitter modelIBM·Filed 2016·Granted Jan 7, 2020·2 cites·9 claims
- 1072US9542516B1Spice circuit model for twinaxial cableIBM·Filed 2016·Granted Jan 10, 2017·1 cites·1 claims
- 1169US9972566B2Interconnect array pattern with a 3:1 signal-to-ground ratioIBM·Filed 2016·Granted May 15, 2018·1 cites·19 claims
- 1268US8203206B2Crosstalk reduction in electrical interconnects using differential signalingCHEN ZHAOQING·Filed 2011·Granted Jun 19, 2012·3 cites·10 claims
- 1363US7131080B2Simulation management systemIBM·Filed 2003·Granted Oct 31, 2006·13 cites·30 claims
- 1460US7985927B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Jul 26, 2011·1 cites·22 claims
- 1560US7897879B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Mar 1, 2011·1 cites·20 claims
- 1658US10943044B2Transient and AC simulations with traveling wave probe circuitIBM·Filed 2017·Granted Mar 9, 2021·0 cites·10 claims
- 1758US9703908B2Spice circuit model for twinaxial cableIBM·Filed 2016·Granted Jul 11, 2017·0 cites·1 claims
- 1858US9697311B2Spice circuit model for twinaxial cableIBM·Filed 2016·Granted Jul 4, 2017·0 cites·1 claims
- 1957US11120189B2Single-ended-mode to mixed-mode transformer spice circuit model for high-speed system signal integrity simulationsIBM·Filed 2018·Granted Sep 14, 2021·0 cites·3 claims
- 2057US10803220B2Transient and AC simulations with traveling wave probe circuitIBM·Filed 2017·Granted Oct 13, 2020·0 cites·11 claims
- 2156US9858370B2Spice circuit model for twinaxial cableIBM·Filed 2015·Granted Jan 2, 2018·0 cites·19 claims
- 2256US7111275B2Electronic circuit design analysis systemIBM·Filed 2003·Granted Sep 19, 2006·7 cites·31 claims
- 2353US9594865B2Distribution of power vias in a multi-layer circuit boardIBM·Filed 2015·Granted Mar 14, 2017·0 cites·13 claims
- 2453US2017006709A1Pad-to-pad embedded capacitance in lieu of signal via transitions in printed circuit boardsIBM·Filed 2015·Application pending·0 cites
- 2552US2017004923A1Pad-to-pad embedded capacitance in lieu of signal via transitions in printed circuit boardsIBM·Filed 2015·Application pending·0 cites
- 2651US9984188B2Single ended-mode to mixed-mode transformer spice circuit model for high-speed system signal integrity simulationsIBM·Filed 2016·Granted May 29, 2018·0 cites·12 claims
- 2748US7219046B2Characterizing input/output modelsIBM·Filed 2003·Granted May 15, 2007·3 cites·17 claims
- 2838US2018113974A1Neural Network Based Prediction of PCB Glass Weave Induced SkewIBM·Filed 2016·Application pending·0 cites
- 2937US6694289B1Fast simulation method for single and coupled lossy lines with frequency-dependent parameters based on triangle impulse responsesIBM·Filed 1999·Granted Feb 17, 2004·9 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →