Inventor · disambiguated record
Zhengping Jiang
Also filed as: JIANG ZHENGPING
6 granted patents·3 pending applications·15 citations·filing 2017–2025
76Inventor score
Top patents by PatentIndex Score
9 records- 0194US12168538B2Continuous unloading and packaging system of pharmaceutical additive manufacturingTRIASTEK INC·Filed 2021·Granted Dec 17, 2024·3 cites·18 claims
- 0288US11171211B1Group IV and III-V p-type MOSFET with high hole mobility and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 9, 2021·4 cites·20 claims
- 0387US12272043B2Semiconductor topography simulation of non-removal type processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·1 cites·20 claims
- 0486US12118707B2System and method for semiconductor topography simulationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 15, 2024·1 cites·20 claims
- 0583US10621494B2System and method for circuit simulation based on recurrent neural networksSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·6 cites·24 claims
- 0674US2025259292A1Semiconductor topography simulation of non-removal type processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0772US2024378715A1System and method for semiconductor topography simulationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0852US11003737B2Generic high-dimensional importance sampling methodologySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 11, 2021·0 cites·18 claims
- 0948US2023394210A1Semiconductor Device Simulation PlatformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →