Inventor · disambiguated record
Zheng Kang
Also filed as: KANG ZHENG
1 granted patent·4 pending applications·0 citations·filing 2019–2024
5Inventor score
Top patents by PatentIndex Score
5 records- 0153US2025210586A1Semiconductor package substrate dicing and edge passivationINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025062168A1Method and Stiffeners for Package Level Warpage ModulationINTEL CORP·Filed 2023·Application pending·0 cites
- 0353US2025112162A1Deep cavity metallization and fiducial arrangements for embedded die and assembly thereof on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 0453US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 0545US11897988B2Hydrogenated styrene/conjugated diolefin copolymer, foaming material thereof, and application thereofCHINA PETROLEUM & CHEM CORP·Filed 2019·Granted Feb 13, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →