Inventor · disambiguated record
Zhiming Lai
Also filed as: LAI ZHIMING
2 granted patents·1 pending application·0 citations·filing 2011–2016
21Inventor score
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3 records- 0136US8987055B2Method for packaging low-K chipZHANG LI·Filed 2011·Granted Mar 24, 2015·0 cites·8 claims
- 0232US2016322539A1Led packaging structureJIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD·Filed 2013·Application pending·0 cites
- 0324US10777477B2Chip packaging structure, and packaging method thereofJIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD·Filed 2016·Granted Sep 15, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →