Inventor · disambiguated record
Zhenan Lai
Also filed as: Lai Zhenan
3 granted patents·0 citations·filing 2020–2023
37Inventor score
Files withSHANGHAI HUALI INTEGRATED CIRCUIT CORP3
Top patents by PatentIndex Score
3 records- 0149US12044723B2Circuit for temperature stress test for memory chipsSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2022·Granted Jul 23, 2024·0 cites·14 claims
- 0241US12260924B2Testability circuit and read and write path decoupling circuit of SRAMSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2023·Granted Mar 25, 2025·0 cites·13 claims
- 0330US11462290B2Wafer acceptance test module and method for a static memory function testSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2020·Granted Oct 4, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →