Inventor · disambiguated record
Zhaozhi Li
Also filed as: LI ZHAOZHI · Li Zhaozhi George
5 granted patents·5 pending applications·23 citations·filing 2015–2024
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0193US10121722B1Architecture material and process to improve thermal performance of the embedded die packageINTEL CORP·Filed 2017·Granted Nov 6, 2018·12 cites·25 claims
- 0287US9653411B1Electronic package that includes fine powder coatingINTEL CORP·Filed 2015·Granted May 16, 2017·10 cites·10 claims
- 0368US11127706B2Electronic package with stud bump electrical connectionsINTEL CORP·Filed 2018·Granted Sep 21, 2021·1 cites·12 claims
- 0464US11552035B2Electronic package with stud bump electrical connectionsINTEL CORP·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 0558US2025273548A1Package comprising a bridge with spring padsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0657US2025183211A1Stress mitigating pillar bumpsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0749US2023317676A1Bond head design for thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0849US2023317675A1Non-planar pedestal for thermal compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0945US11462527B2Micro-trenching mold interface in a pop packageINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·25 claims
- 1039US2020098727A1Stacked wire-bond dice attached by pillars or bumps above a flip-chip die on a semiconductor package substrateMALLIK DEBENDRA·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →