Inventor · disambiguated record
Zhaohui Ma
Also filed as: MA ZHAOHUI
20 granted patents·5 pending applications·49 citations·filing 2012–2025
93Inventor score
Files withMICRON TECHNOLOGY INC21Zhangjiakou cigarette factory co ltd2MA ZHAOHUI1WANGMO TECH WUHAN CO LTD1
Top patents by PatentIndex Score
25 records- 0193US9349670B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted May 24, 2016·11 cites·16 claims
- 0286US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 0385US11670612B2Method for solder bridging elimination for bulk solder C2S interconnectsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·1 cites·14 claims
- 0485US9589933B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 7, 2017·6 cites·20 claims
- 0584US9202714B2Methods for forming semiconductor device packagesMA ZHAOHUI·Filed 2012·Granted Dec 1, 2015·11 cites·20 claims
- 0683US10153178B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·2 cites·18 claims
- 0783US2024429190A1Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0882US9786612B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 10, 2017·3 cites·20 claims
- 0981US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 1081US9716019B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 25, 2017·2 cites·23 claims
- 1179US10923448B2Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 16, 2021·2 cites·11 claims
- 1278US10312226B2Semiconductor devices comprising protected side surfaces and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·2 cites·20 claims
- 1376US9786643B2Semiconductor devices comprising protected side surfaces and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 10, 2017·3 cites·11 claims
- 1471US12087719B2Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 10, 2024·0 cites·9 claims
- 1566US11705425B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·18 claims
- 1662US10636678B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 28, 2020·0 cites·20 claims
- 1761US2024008521A1Device and method for reducing combustion cone fallout propensity and stabilizing loss of tobacco from cigarette endsZhangjiakou cigarette factory co ltd·Filed 2023·Application pending·0 cites
- 1860US10734370B2Methods of making semiconductor devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 4, 2020·0 cites·18 claims
- 1956US2016093583A1Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 2053US11024595B2Thermocompression bond tips and related apparatus and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 1, 2021·0 cites·19 claims
- 2151US2023380159A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2250US2019067232A1Method for Solder Bridging Elimination for Bulk Solder C2S InterconnectsMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 2349US9337064B2Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systemsMICRON TECHNOLOGY INC·Filed 2014·Granted May 10, 2016·0 cites·16 claims
- 2447US12262731B2Cut-stem separating and baffling apparatus and primary air separation apparatusZhangjiakou cigarette factory co ltd·Filed 2023·Granted Apr 1, 2025·0 cites·10 claims
- 2546US12505476B2System and method for rapid bionic entity fitting samplingWANGMO TECH WUHAN CO LTD·Filed 2025·Granted Dec 23, 2025·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →