Inventor · disambiguated record
Zhiguo Qian
Also filed as: QIAN ZHIGUO
73 granted patents·15 pending applications·333 citations·filing 2011–2024
98Inventor score
Top patents by PatentIndex Score
88 records- 0198US11621227B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2021·Granted Apr 4, 2023·6 cites·25 claims
- 0297US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0397US11901280B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0497US11837549B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2022·Granted Dec 5, 2023·3 cites·20 claims
- 0597US11817391B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2023·Granted Nov 14, 2023·3 cites·20 claims
- 0697US9275971B2Bridge interconnect with air gap in package assemblyINTEL CORP·Filed 2014·Granted Mar 1, 2016·33 cites·21 claims
- 0797US8946900B2X-line routing for dense multi-chip-package interconnectsQIAN ZHIGUO·Filed 2012·Granted Feb 3, 2015·62 cites·14 claims
- 0897US8872349B2Bridge interconnect with air gap in package assemblyCHIU CHIA-PIN·Filed 2012·Granted Oct 28, 2014·83 cites·24 claims
- 0996US12062616B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2023·Granted Aug 13, 2024·2 cites·20 claims
- 1096US9515017B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2015·Granted Dec 6, 2016·12 cites·22 claims
- 1193US11222848B2Power delivery for embedded bridge die utilizing trench structuresINTEL CORP·Filed 2017·Granted Jan 11, 2022·6 cites·25 claims
- 1293US9240377B2X-line routing for dense multi-chip-package interconnectsQIAN ZHIGUO·Filed 2014·Granted Jan 19, 2016·16 cites·10 claims
- 1392US10950550B2Semiconductor package with through bridge die connectionsINTEL CORP·Filed 2015·Granted Mar 16, 2021·10 cites·22 claims
- 1492US10658279B2High density package interconnectsINTEL CORP·Filed 2019·Granted May 19, 2020·6 cites·19 claims
- 1589US9806011B2Non-uniform substrate stackupINTEL CORP·Filed 2015·Granted Oct 31, 2017·7 cites·11 claims
- 1688US9230900B1Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2014·Granted Jan 5, 2016·9 cites·25 claims
- 1787US12482733B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1887US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 1986US9542522B2Interconnect routing configurations and associated techniquesINTEL CORP·Filed 2014·Granted Jan 10, 2017·6 cites·15 claims
- 2086US9368437B2High density package interconnectsGANESAN SANKA·Filed 2011·Granted Jun 14, 2016·6 cites·28 claims
- 2184US11450613B2Integrated circuit package with test circuitry for testing a channel between diesINTEL CORP·Filed 2018·Granted Sep 20, 2022·4 cites·15 claims
- 2284US10845552B2Coreless package architecture for multi-chip opto-electronicsINTEL CORP·Filed 2017·Granted Nov 24, 2020·4 cites·25 claims
- 2384US9922916B2High density package interconnectsINTEL CORP·Filed 2016·Granted Mar 20, 2018·3 cites·22 claims
- 2483US10056528B1Interposer structures, semiconductor assembly and methods for forming interposer structuresINTEL CORP·Filed 2017·Granted Aug 21, 2018·4 cites·23 claims
- 2583US10026682B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2016·Granted Jul 17, 2018·2 cites·20 claims
- 2682US10840196B1Trace modulations in connectors for integrated-circuit packagesINTEL CORP·Filed 2019·Granted Nov 17, 2020·4 cites·16 claims
- 2781US11450560B2Microelectronic assemblies having magnetic core inductorsINTEL CORP·Filed 2018·Granted Sep 20, 2022·3 cites·19 claims
- 2881US9548734B1Smart impedance matching for high-speed I/OSONG HONGJIANG·Filed 2015·Granted Jan 17, 2017·4 cites·21 claims
- 2979US11984439B2Microelectronic assembliesINTEL CORP·Filed 2018·Granted May 14, 2024·2 cites·17 claims
- 3079US11742275B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 3178US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 3277US11276635B2Horizontal pitch translation using embedded bridge diesINTEL CORP·Filed 2017·Granted Mar 15, 2022·2 cites·22 claims
- 3375US11244890B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
- 3475US10748842B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2018·Granted Aug 18, 2020·1 cites·17 claims
- 3575US10103054B2Coupled vias for channel cross-talk reductionINTEL CORP·Filed 2013·Granted Oct 16, 2018·4 cites·14 claims
- 3674US10204851B2High density package interconnectsINTEL CORP·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 3774US2024258296A1Microelectronic assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 3873US11682613B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 3971US11031341B2Side mounted interconnect bridgesINTEL CORP·Filed 2017·Granted Jun 8, 2021·2 cites·7 claims
- 4071US9589866B2Bridge interconnect with air gap in package assemblyINTEL CORP·Filed 2016·Granted Mar 7, 2017·1 cites·18 claims
- 4170US11081434B2Package substrates with magnetic build-up layersINTEL CORP·Filed 2020·Granted Aug 3, 2021·0 cites·16 claims
- 4269US11887932B2Dielectric-filled trench isolation of viasINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·10 claims
- 4369US11387188B2High density interconnect structures configured for manufacturing and performanceINTEL CORP·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 4468US11694952B2Horizontal pitch translation using embedded bridge diesINTEL CORP·Filed 2022·Granted Jul 4, 2023·0 cites·25 claims
- 4568US10892225B2Die interconnect structures and methodsINTEL CORP·Filed 2016·Granted Jan 12, 2021·1 cites·18 claims
- 4668US10867926B2High density interconnect structures configured for manufacturing and performanceINTEL CORP·Filed 2020·Granted Dec 15, 2020·0 cites·19 claims
- 4768US9232639B2Non-uniform substrate stackupINTEL CORP·Filed 2012·Granted Jan 5, 2016·2 cites·16 claims
- 4867US10854539B2Ground via clustering for crosstalk mitigationINTEL CORP·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 4967US10283453B2Interconnect routing configurations and associated techniquesINTEL CORP·Filed 2016·Granted May 7, 2019·1 cites·16 claims
- 5066US11456281B2Architecture and processes to enable high capacity memory packages through memory die stackingINTEL CORP·Filed 2018·Granted Sep 27, 2022·1 cites·16 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →