Inventor · disambiguated record
Zheng Tao
Also filed as: TAO ZHENG · Tao zheng ji
22 granted patents·7 pending applications·8 citations·filing 2012–2023
89Inventor score
Files withIMEC VZW23BYD CO LTD2STARSE ENERGY AND TECH GROUP CO LTD2BAO ZHONG1UNISANTIS ELECT SINGAPORE PTE1
Top patents by PatentIndex Score
29 records- 0176US11107812B2Method of fabricating stacked semiconductor deviceIMEC VZW·Filed 2019·Granted Aug 31, 2021·2 cites·18 claims
- 0275US9899220B2Method for patterning a substrate involving directed self-assemblyIMEC VZW·Filed 2016·Granted Feb 20, 2018·2 cites·12 claims
- 0370US12237207B2Method for forming a buried metal line in a semiconductor substrateIMEC VZW·Filed 2023·Granted Feb 25, 2025·0 cites·8 claims
- 0470US10090393B2Method for forming a field effect transistor device having an electrical contactIMEC VZW·Filed 2016·Granted Oct 2, 2018·2 cites·19 claims
- 0568US10153341B2Method of forming internal spacer for nanowiresIMEC VZW·Filed 2017·Granted Dec 11, 2018·1 cites·18 claims
- 0660US12512417B2Method and structure for determining an overlay errorIMEC VZW·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0758US2024154006A1Method for forming a semiconductor deviceIMEC VZW·Filed 2023·Application pending·0 cites
- 0856US12451429B2Interconnection structure for a semiconductor deviceIMEC VZW·Filed 2022·Granted Oct 21, 2025·0 cites·18 claims
- 0956US2021028059A1Method for Forming a Buried Metal Line in a Semiconductor SubstrateIMEC VZW·Filed 2020·Application pending·0 cites
- 1055US11776841B2Buried power rail contact formationIMEC VZW·Filed 2021·Granted Oct 3, 2023·0 cites·15 claims
- 1154US11862452B2Contact isolation in semiconductor devicesIMEC VZW·Filed 2020·Granted Jan 2, 2024·0 cites·19 claims
- 1254US11824122B2Method for filling a space in a semiconductorIMEC VZW·Filed 2021·Granted Nov 21, 2023·0 cites·15 claims
- 1354US2024036470A1Method for Forming an Interconnect StructureIMEC VZW·Filed 2023·Application pending·0 cites
- 1453USD1029687SBusBYD CO LTD·Filed 2021·Granted Jun 4, 2024·1 cites·1 claims
- 1550US12381116B2Method of manufacturing an interconnection structure for a semiconductor device having a spacer separating first and second conductive linesIMEC VZW·Filed 2022·Granted Aug 5, 2025·0 cites·10 claims
- 1647US11430697B2Method of forming a mask layerIMEC VZW·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 1744US10493378B2Method of forming micro-pipes on a substrate and a structure formed thereofIMEC VZW·Filed 2017·Granted Dec 3, 2019·0 cites·8 claims
- 1843US10825822B2Pillar-shaped semiconductor device and method for producing the sameUNISANTIS ELECT SINGAPORE PTE·Filed 2018·Granted Nov 3, 2020·0 cites·20 claims
- 1942USD1054915SBusBYD CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·1 claims
- 2041US2019271660A1Nanopore formed through fin by self-alignmentIMEC VZW·Filed 2019·Application pending·0 cites
- 2140US2019198643A1Vertical channel device and method of forming sameIMEC VZW·Filed 2018·Application pending·0 cites
- 2239US10790382B2Method for forming horizontal nanowires and devices manufactured thereofIMEC VZW·Filed 2017·Granted Sep 29, 2020·0 cites·21 claims
- 2338US10825682B2Method for producing a pillar structure in a semiconductor layerIMEC VZW·Filed 2016·Granted Nov 3, 2020·0 cites·20 claims
- 2437US10128371B2Self-aligned nanostructures for semiconductor devicesIMEC VZW·Filed 2016·Granted Nov 13, 2018·0 cites·14 claims
- 2537US9520291B2Method of providing an implanted region in a semiconductor structureIMEC VZW·Filed 2015·Granted Dec 13, 2016·0 cites·17 claims
- 2632US9548208B2Method for patterning an underlying layerIMEC VZW·Filed 2016·Granted Jan 17, 2017·0 cites·12 claims
- 2731US2014133840A1Method which uses multi-media to configure a multi-media capturing deviceBAO ZHONG·Filed 2012·Application pending·0 cites
- 2820US10767450B2Sand control screen for heavy oil thermal recoverySTARSE ENERGY AND TECH GROUP CO LTD·Filed 2016·Granted Sep 8, 2020·0 cites·7 claims
- 2919US2020102806A1Composite water-controlling and flow-limiting device and screen pipe thereofSTARSE ENERGY AND TECH GROUP CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →