Inventor · disambiguated record

Zhiliang Xia

Also filed as: XIA ZHILIANG

176 granted patents·118 pending applications·215 citations·filing 2013–2025

99Inventor score

Technology areasH10W H10B H10P H10D H01L

Files withYANGTZE MEMORY TECH CO LTD285 SAMSUNG ELECTRONICS CO LTD4 YUN JANG-GN2 KIM CHIHO1 PARK MIN-CHUL1

Top patents by PatentIndex Score

294 records

0198US11699659B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 11, 2023·3 cites·20 claims
0298US11562945B2Semiconductor device having a spacer structure in a conductive layer and a contact structure in the spacer structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 24, 2023·7 cites·20 claims
0398US11227871B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·20 claims
0498US10510415B1Memory device using comb-like routing structure for reduced metal line loadingYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 17, 2019·36 cites·20 claims
0597US11862565B2Contact structures for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·5 claims
0697US11574922B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
0797US11233007B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·4 cites·20 claims
0897US10930661B2Embedded pad structures of three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 23, 2021·16 cites·8 claims
0996US12255181B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·2 cites·20 claims
1096US12136586B2Semiconductor devices having a conductive layer stacking with an insulating layer and a spacer structure through the conductive layerYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·19 claims
1196US12136618B2Three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
1296US11935596B2Three-dimensional memory devices having polysilicon layer and bonded semiconductor structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
1396US11222903B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 11, 2022·4 cites·20 claims
1496US9786676B2Vertical memory devices and methods of manufacturing the sameYUN JANG-GN·Filed 2016·Granted Oct 10, 2017·15 cites·20 claims
1595US12020750B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 25, 2024·2 cites·17 claims
1695US11929119B2Three-dimensional memory devices and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 12, 2024·3 cites·18 claims
1795US11903195B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Feb 13, 2024·2 cites·19 claims
1895US11456290B2Three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
1994US12052870B2Staircase structure with multiple divisions for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 30, 2024·2 cites·19 claims
2093US12082408B2Three-dimensional memory devices having first semiconductor structure bonded with second semiconductor structure each including peripheral circuit and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 3, 2024·2 cites·20 claims
2193US10804283B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Oct 13, 2020·8 cites·6 claims
2292US11735543B2DRAM memory device with xtacking architectureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 22, 2023·2 cites·20 claims
2391US11837541B2Memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 5, 2023·2 cites·20 claims
2491US10727245B2Trench structures for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Jul 28, 2020·5 cites·20 claims
2591US2025120090A1Embedded pad structures of three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
2691US2025344393A1Methods for forming three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
2791US2025120086A1Three-dimensional nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
2890US11574919B2Openings layout of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
2990US9859296B2Semiconductor devices including a conductive pattern contacting a channel pattern and methods of manufacturing the samePARK SE-JUN·Filed 2016·Granted Jan 2, 2018·9 cites·16 claims
3089US11716853B2Method for fabricating three-dimensional memory device by thickening an epitaxial layerYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·15 claims
3189US11696439B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 4, 2023·2 cites·16 claims
3289US11508750B2Three-dimensional memory device including a peripheral circuit and a memory stackYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
3389US11450637B2Methods for bonding semiconductor structures and semiconductor devices thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·20 claims
3489US10651192B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 12, 2020·4 cites·16 claims
3589US9853045B2Semiconductor device having channel holesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·7 cites·9 claims
3688US11812614B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 7, 2023·1 cites·20 claims
3788US11626416B2Method for forming three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 11, 2023·2 cites·20 claims
3888US2025318117A1Trench structures for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
3988US2024339404A13d nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
4088US2025378879A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
4187US12262533B2Dynamic flash memory (DFM) with multi-cellsYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 25, 2025·1 cites·14 claims
4287US12046555B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·18 claims
4387US10840125B2Memory structure and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·18 claims
4487US2025133734A1Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
4586US12477749B2Three-dimensional memory devices having semiconductor assemblies bonded by bonding layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 18, 2025·1 cites·20 claims
4685US12302573B2Three-dimensional memory device with backside interconnect structuresYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
4785US12191269B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 7, 2025·1 cites·20 claims
4885US12167605B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
4985US12069854B2Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
5084US12412628B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims

Showing the top 50 of 294 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →