Inventor · disambiguated record
Zhiqiang Xie
Also filed as: XIE ZHIQIANG
19 granted patents·5 pending applications·100 citations·filing 2015–2025
92Inventor score
Files withMICRON TECHNOLOGY INC9FUZHOU LEISIAO INFORMATION TECH CO LTD4INTEL CORP3HUAWEI TECH CO LTD2UNIV TENNESSEE RES FOUND2
Top patents by PatentIndex Score
24 records- 0196US10388665B1Methods of forming an array of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stackMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·46 cites·22 claims
- 0289USD956143SElectric scooterFUZHOU LEISIAO INFORMATION TECH CO LTD·Filed 2020·Granted Jun 28, 2022·16 cites·1 claims
- 0389US10707121B2Solid state memory device, and manufacturing method thereofINTEL CORP·Filed 2016·Granted Jul 7, 2020·9 cites·24 claims
- 0483USD883294SHubSHENZHEN HENGXI TECH CO LTD·Filed 2020·Granted May 5, 2020·13 cites·1 claims
- 0583US9935000B2Slit stress modulation in semiconductor substratesINTEL CORP·Filed 2016·Granted Apr 3, 2018·3 cites·31 claims
- 0682USD1035780SElectric scooterFUZHOU LEISIAO INFORMATION TECH CO LTD·Filed 2021·Granted Jul 16, 2024·9 cites·1 claims
- 0777US11177271B2Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent theretoMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 16, 2021·2 cites·8 claims
- 0867US11889695B2Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent theretoMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 30, 2024·0 cites·22 claims
- 0966US2025023059A1Electrodes comprising liquid/gas diffusion layers and systems and methods for making and using the sameUNIV TENNESSEE RES FOUND·Filed 2022·Application pending·0 cites
- 1061US2025359585A1Method and application of preparing sun-cured tobacco by irradiationCHINA TOBACCO YUNNAN IND CO LTD·Filed 2025·Application pending·0 cites
- 1160US2023047140A1Electrodes comprising liquid/gas diffusion layers and systems and methods for making and using the sameUNIV TENNESSEE RES FOUND·Filed 2022·Application pending·0 cites
- 1257US12223219B2Screen combination method and apparatusHUAWEI TECH CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
- 1357US10586807B2Arrays of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stacksMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 10, 2020·0 cites·14 claims
- 1456USD1022051SElectric scooterFUZHOU LEISIAO INFORMATION TECH CO LTD·Filed 2020·Granted Apr 9, 2024·2 cites·1 claims
- 1556US10784144B2Slit stress modulation in semiconductor substratesINTEL CORP·Filed 2018·Granted Sep 22, 2020·0 cites·21 claims
- 1653US12236155B2Method and communication system for controlling plurality of screen devicesHUAWEI TECH CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1753US11387369B2Semiconductor structure formationMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 12, 2022·0 cites·14 claims
- 1852US11563008B2Integrated memory with redistribution of capacitor connections, and methods of forming integrated memoryMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 24, 2023·0 cites·25 claims
- 1952US10937690B2Selective dielectric depositionMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 2, 2021·0 cites·18 claims
- 2052US2025002409A1Hydraulic ecc material and application thereofCHANGJIANG RIVER SCIENT RES INST CHANGJIANG WATER RESOURCES COMMISSION·Filed 2023·Application pending·0 cites
- 2148US12408318B2Semiconductor formation using hybrid oxidationMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 2, 2025·0 cites·14 claims
- 2246US11295454B1Object detection method, security device, and readable storage mediumSHENZHEN REOLINK TECH CO LTD·Filed 2021·Granted Apr 5, 2022·0 cites·12 claims
- 2343US2021301571A1Folding MechanismFUZHOU LEISIAO INFORMATION TECH CO LTD·Filed 2020·Application pending·0 cites
- 2442US10163655B2Through substrate via liner densificationMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 25, 2018·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →