Inventor · disambiguated record
Zhixin Xie
Also filed as: XIE ZHIXIN
0 granted patents·15 pending applications·0 citations·filing 2022–2024
Files withINTEL CORP15
Top patents by PatentIndex Score
15 records- 0155US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0255US2025374426A1Automated manufacturing of hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0355US2025144857A1Molding system and molding methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0454US2025112138A1Microelectronic structures including glass substrates with dielectric based liner materials.INTEL CORP·Filed 2023·Application pending·0 cites
- 0554US2025218984A1Encapsulation techniques for components embedded in a core layer of a package substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 0654US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 0753US2025391720A1Integrated circuit packages including substrates with encapsulated glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0853US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
- 0953US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1052US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1152US2025218885A1Patterned mold underfill (muf) films for deep trench fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 1248US2024327679A1Media tray with switchable adhesionINTEL CORP·Filed 2023·Application pending·0 cites
- 1348US2024222216A1Patterned sheet muf for complex packages and methods of producingINTEL CORP·Filed 2022·Application pending·0 cites
- 1447US2024210634A1Functionally graded index mold for co-packaged optical applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 1546US2024188223A1Material deposition apparatus and methodINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →