Inventor · disambiguated record
Zhijun Xu
Also filed as: XU ZHIJUN
24 granted patents·6 pending applications·34 citations·filing 2010–2023
92Inventor score
Files withCOUPANG CORP11INTEL CORP5BOE TECHNOLOGY GROUP CO LTD3CHONGQING BOE OPTOELECTRONICS TECH CO LTD2FOCUS LIGHTINGS TECH CO LTD2
Top patents by PatentIndex Score
30 records- 0194US10706387B1Systems and methods for computer-determined efficient packaging determinationCOUPANG CORP·Filed 2019·Granted Jul 7, 2020·16 cites·20 claims
- 0289US10705488B1Systems and methods for computer-determined efficient bagging of ordered itemsCOUPANG CORP·Filed 2019·Granted Jul 7, 2020·6 cites·18 claims
- 0385US11699128B2Systems and methods for computer-determined efficient packaging determinationCOUPANG CORP·Filed 2020·Granted Jul 11, 2023·2 cites·18 claims
- 0477US11301804B2Systems and methods for simulation of package configurations for generating cost optimized configurationsCOUPANG CORP·Filed 2019·Granted Apr 12, 2022·1 cites·18 claims
- 0576US11327447B2Systems and methods for computer-determined efficient bagging of ordered itemsCOUPANG CORP·Filed 2020·Granted May 10, 2022·1 cites·20 claims
- 0676US11138527B2Systems and methods for responsive and automated predictive packaging acquisitionCOUPANG CORP·Filed 2019·Granted Oct 5, 2021·1 cites·20 claims
- 0772US11894344B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 0872US9961002B2PacketUsher: accelerating computer-intensive packet processingUNIV MACAU SCI & TECH·Filed 2015·Granted May 1, 2018·2 cites·20 claims
- 0967US12198097B2Systems and methods for simulation of package configurations for generating cost optimized configurationsCOUPANG CORP·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1062US11727354B2Systems and methods for initial item grouping logicCOUPANG CORP·Filed 2021·Granted Aug 15, 2023·0 cites·18 claims
- 1162US10001930B2High-efficient packet I/O engine for commodity PCUNIV MACAU SCI & TECH·Filed 2015·Granted Jun 19, 2018·1 cites·14 claims
- 1260US9520538B2LED epitaxial structure and fabrication method thereofXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2015·Granted Dec 13, 2016·1 cites·11 claims
- 1360US2021398036A1Systems and methods for responsive and automated predictive packaging acquisitionCOUPANG CORP·Filed 2021·Application pending·0 cites
- 1456US8724630B2Method and system for implementing network intercommunicationXU ZHIJUN·Filed 2010·Granted May 13, 2014·2 cites·18 claims
- 1555US11302671B2Power enhanced stacked chip scale package solution with integrated die attach filmINTEL CORP·Filed 2017·Granted Apr 12, 2022·0 cites·20 claims
- 1654US11864326B2Substrate, maintenance method and display deviceCHONGQING BOE OPTOELECTRONICS TECH CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·18 claims
- 1754US11232401B2Systems and methods for initial item grouping logicCOUPANG CORP·Filed 2020·Granted Jan 25, 2022·0 cites·14 claims
- 1853US2025233097A1Systems and methods for reducing stress and improving surface adhesion in a dieSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2022·Application pending·0 cites
- 1953US2024405159A1Growth method and structure of led epitaxyFOCUS LIGHTINGS TECH SUQIAN CO LTD·Filed 2023·Application pending·0 cites
- 2052US12027496B2Film in substrate for releasing z stack-up constraintINTEL CORP·Filed 2019·Granted Jul 2, 2024·0 cites·25 claims
- 2152US8409465B1Deicing salt composition and method for preparing the sameCHENG XINCHUAN·Filed 2012·Granted Apr 2, 2013·1 cites·4 claims
- 2249US2025081672A1Led chip based on alumina-silica composite substrate and fabrication method thereofFOCUS LIGHTINGS TECH CO LTD·Filed 2023·Application pending·0 cites
- 2348US11990395B2Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancementINTEL CORP·Filed 2019·Granted May 21, 2024·0 cites·25 claims
- 2448US11379786B2Electronic apparatus and information providing method thereofCOUPANG CORP·Filed 2020·Granted Jul 5, 2022·0 cites·14 claims
- 2548US10705357B2Display substrate, display panel and method for repairing bright spotsBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Jul 7, 2020·0 cites·13 claims
- 2647US11742284B2Interconnect structure fabricated using lithographic and deposition processesINTEL CORP·Filed 2018·Granted Aug 29, 2023·0 cites·22 claims
- 2745US2015323715A1Method for manufacturing a color filter, and a color filterBOE TECHNOLOGY GROUP CO LTD·Filed 2013·Application pending·0 cites
- 2844US10871689B2Display substrate, display panel, display device and bonding methodBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Dec 22, 2020·0 cites·18 claims
- 2938US12369432B2LED epitaxial structure and preparation method and application thereofFOCUS LIGHTINGS TECH CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·9 claims
- 3036US2021278718A1Display substrate, display device and method for manufacturing display substrateCHONGQING BOE OPTOELECTRONICS TECH CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →