Inventor · disambiguated record
Zhan Yang
Also filed as: YANG ZHAN · YANG ZHAN BO · YANG ZHAN HANG
5 granted patents·6 pending applications·1 citations·filing 2001–2024
61Inventor score
Files withHENKEL AG & CO KGAA5BEIJING XIAOMI MOBILE SOFTWARE CO LTD1Henkel IP & Holding GmbH1INST OF PLA FOR DISEASE CONTROL AND PREVENTION1UNIV SOOCHOW1
Top patents by PatentIndex Score
11 records- 0169US11814530B2Stretchable electrically conductive ink compositionsHenkel IP & Holding GmbH·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 0268US2024218218A1Optically clear uv and thermal curing epoxy compositionsHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0368US2025101279A1Optically clear (meth) acrylate adhesives having improved surface curingHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0462US12480888B2Macro plastic and micro plastic detection method based on RGB and hyperspectral image fusionUNIV TONGJI·Filed 2023·Granted Nov 25, 2025·0 cites·10 claims
- 0562US2022380645A1High creep recovery, low modulus polymer systems and methods of making themHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0661US2023114308A1Flux-Compatible Epoxy-Anhydride Adhesives Compositions for Low-Gap Underfill ApplicationsHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0753USD1017308SWater purifierBEIJING XIAOMI MOBILE SOFTWARE CO LTD·Filed 2022·Granted Mar 12, 2024·1 cites·1 claims
- 0853US2024010890A1Flux-compatible epoxy-phenolic adhesive compositions for low gap underfill applicationsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0943US11228259B2Hybrid rotary energy harvesterUNIV SOOCHOW·Filed 2017·Granted Jan 18, 2022·0 cites·10 claims
- 1028US2002165501A1Safety SyringeFiled 2001·Application pending·0 cites
- 1125US10544452B2Method and use of nucleic acid isothermal amplification via a polymerase spiral reactionINST OF PLA FOR DISEASE CONTROL AND PREVENTION·Filed 2015·Granted Jan 28, 2020·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →