Inventor · disambiguated record
Zhongqiang Yang
Also filed as: YANG ZHONGQIANG
12 granted patents·4 pending applications·6 citations·filing 2011–2019
81Inventor score
Top patents by PatentIndex Score
16 records- 0182US9193858B2Thermoset resin composition and its useGUANGDONG SHENGYI SCI TECH CO·Filed 2013·Granted Nov 24, 2015·5 cites·15 claims
- 0280US11377551B2Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 5, 2022·1 cites·21 claims
- 0354US12104054B2Resin composition, prepreg containing same, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Oct 1, 2024·0 cites·10 claims
- 0453US11319397B2Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted May 3, 2022·0 cites·18 claims
- 0553US9611377B2Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·19 claims
- 0651US10400173B2Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·22 claims
- 0748US2022135788A1Resin composition, prepreg containing same, and laminate board and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Application pending·0 cites
- 0841US11744013B2Composite, high-frequency circuit substrate prepared therefrom and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Aug 29, 2023·0 cites·13 claims
- 0941US2016007452A1Circuit substrate and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1041US2018126701A1Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit boards using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 1140US9752028B2Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 5, 2017·0 cites·10 claims
- 1238US10494502B2Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 3, 2019·0 cites·20 claims
- 1337US10400058B2Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereofSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 3, 2019·0 cites·9 claims
- 1433US11191158B2Circuit board and process for preparing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Nov 30, 2021·0 cites·21 claims
- 1532US9475970B2Epoxy resin composition and copper clad laminate manufactured by using sameDU CUIMING·Filed 2011·Granted Oct 25, 2016·0 cites·5 claims
- 1632US2016185952A1Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the SameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →