Inventor · disambiguated record
Zhiping Yin
Also filed as: YIN ZHIPING
102 granted patents·19 pending applications·2,235 citations·filing 1997–2021
99Inventor score
Top patents by PatentIndex Score
121 records- 0198US7576441B2Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 18, 2009·67 cites·5 claims
- 0298US7253118B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 7, 2007·161 cites·52 claims
- 0397US7924333B2Method and apparatus providing shared pixel straight gate architectureAPTINA IMAGING CORP·Filed 2007·Granted Apr 12, 2011·49 cites·22 claims
- 0497US7651951B2Pitch reduced patterns relative to photolithography featuresMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 26, 2010·46 cites·28 claims
- 0597US6515355B1Passivation layer for packaged integrated circuitsMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 4, 2003·191 cites·14 claims
- 0697US6316285B1Passivation layer for packaged integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·216 cites·18 claims
- 0796US6670284B2Method of decontaminating process chambers, methods of reducing defects in anti-reflective coatings, and resulting semiconductor structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 30, 2003·76 cites·29 claims
- 0895US10128229B1Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 13, 2018·12 cites·8 claims
- 0995US7718540B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2007·Granted May 18, 2010·22 cites·5 claims
- 1094US8048812B2Pitch reduced patterns relative to photolithography featuresROUND ROCK RES LLC·Filed 2010·Granted Nov 1, 2011·11 cites·20 claims
- 1193US8207576B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2007·Granted Jun 26, 2012·18 cites·25 claims
- 1293US6156674ASemiconductor processing methods of forming insulative materialsMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 5, 2000·129 cites·50 claims
- 1392US10312232B1Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 4, 2019·6 cites·8 claims
- 1492US8598632B2Integrated circuit having pitch reduced patterns relative to photoithography featuresTRAN LUAN·Filed 2012·Granted Dec 3, 2013·10 cites·6 claims
- 1592US7270917B2Prevention of photoresist scummingMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 18, 2007·10 cites·23 claims
- 1692US6573175B1Dry low k film application for interlevel dielectric and method of cleaning etched featuresMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 3, 2003·37 cites·78 claims
- 1791US7175944B2Prevention of photoresist scummingMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 13, 2007·27 cites·22 claims
- 1891US6939794B2Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·49 cites·25 claims
- 1991US6174816B1Treatment for film surface to reduce photo footingMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 16, 2001·46 cites·18 claims
- 2089US8350939B2Vertical 4-way shared pixel in a single column with internal reset and no row selectMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 8, 2013·8 cites·20 claims
- 2189US6380611B1Treatment for film surface to reduce photo footingMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 30, 2002·70 cites·24 claims
- 2288US8130304B2Image sensors with pixel charge summingYIN ZHIPING·Filed 2009·Granted Mar 6, 2012·13 cites·17 claims
- 2388US8129093B2Prevention of photoresist scummingYIN ZHIPING·Filed 2010·Granted Mar 6, 2012·4 cites·25 claims
- 2488US8119535B2Pitch reduced patterns relative to photolithography featuresTRAN LUAN·Filed 2009·Granted Feb 21, 2012·8 cites·19 claims
- 2587US7298024B2Transparent amorphous carbon structure in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 20, 2007·7 cites·31 claims
- 2687US7105431B2Masking methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 12, 2006·31 cites·44 claims
- 2787US6890865B2Low k film application for interlevel dielectric and method of cleaning etched featuresMICRON TECHNOLOGY INC·Filed 2003·Granted May 10, 2005·24 cites·62 claims
- 2887US6281100B1Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·62 cites·19 claims
- 2987US6121133AIsolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 19, 2000·57 cites·7 claims
- 3086US7341957B2Masking structure having multiple layers including amorphous carbon layerMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 11, 2008·9 cites·58 claims
- 3185US7989749B2Method and apparatus providing shared pixel architectureAPTINA IMAGING CORP·Filed 2007·Granted Aug 2, 2011·10 cites·37 claims
- 3285US6936539B2Antireflective coating for use during the manufacture of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 30, 2005·26 cites·21 claims
- 3384US6274292B1Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 14, 2001·47 cites·6 claims
- 3484US6225671B1Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated therebyMICRON TECHNOLOGY INC·Filed 2000·Granted May 1, 2001·18 cites·16 claims
- 3583US10580767B2Semiconductor devices with package-level configurabilityMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 3, 2020·2 cites·14 claims
- 3683US6291363B1Surface treatment of DARC films to reduce defects in subsequent cap layersMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 18, 2001·54 cites·21 claims
- 3783US6150257APlasma treatment of an interconnect surface during formation of an interlayer dielectricMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·47 cites·46 claims
- 3882US7220683B2Transparent amorphous carbon structure in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2004·Granted May 22, 2007·16 cites·61 claims
- 3982US7129180B2Masking structure having multiple layers including an amorphous carbon layerMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 31, 2006·22 cites·41 claims
- 4081US6495450B1Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 17, 2002·17 cites·39 claims
- 4180US7186642B2Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 6, 2007·5 cites·10 claims
- 4280US6492267B1Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·19 cites·12 claims
- 4380US6461970B1Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated therebyMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 8, 2002·36 cites·50 claims
- 4480US6461950B2Semiconductor processing methods, semiconductor circuitry, and gate stacksMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·16 cites·19 claims
- 4580US6423582B1Use of DAR coating to modulate the efficiency of laser fuse blowsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 23, 2002·41 cites·35 claims
- 4680US6174590B1Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 16, 2001·37 cites·18 claims
- 4779US7037808B2Method of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted May 2, 2006·5 cites·17 claims
- 4878US9210347B2Vertical 4-way shared pixel in a single column with internal reset and no row selectMICRON TECHNOLOGY INC·Filed 2013·Granted Dec 8, 2015·2 cites·17 claims
- 4978US6784094B2Anti-reflective coatings and methods for forming and using sameMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 31, 2004·14 cites·18 claims
- 5078US6541843B2Anti-reflective coatings and methods for forming and using sameMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 1, 2003·14 cites·9 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →