Inventor · disambiguated record
Zi Qi Wang
Also filed as: Wang zi qi
2 granted patents·3 pending applications·3 citations·filing 2018–2023
43Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC5
Top patents by PatentIndex Score
5 records- 0169US10340246B1Wire ball bonding in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 0262US10692835B2Ball bond attachment for a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·1 cites·17 claims
- 0345US2024250060A1Capillary for stitch bondTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0440US2023275060A1Leaded semiconductor package with lead mold flash reductionTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 0540US2024258215A1Wire bonded semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →