Inventor · disambiguated record
Zongwei Li
Also filed as: LI ZONGWEI
7 granted patents·4 pending applications·8 citations·filing 2016–2025
73Inventor score
Files withINST GEOLOGY & GEOPHYSICS CAS5AVIC JONHON OPTRONIC TECH CO LTD1BEIJING INST OF RADIATION MEDICINE1HUAWEI TECH CO LTD1INST OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES IGGCAS1
Top patents by PatentIndex Score
11 records- 0194US11472696B1Seismic acquisition system and sensor based on MEMS sensor with low power consumptionINST GEOLOGY & GEOPHYSICS CAS·Filed 2022·Granted Oct 18, 2022·5 cites·8 claims
- 0281US11401160B2MEMS sensor detection device and MEMS sensor systemINST GEOLOGY & GEOPHYSICS CAS·Filed 2019·Granted Aug 2, 2022·2 cites·9 claims
- 0370US2025316889A1Antenna system and communication deviceHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0467US10557176B2Method for detecting trace fungi using single-cell sequencing and kit thereofBEIJING INST OF RADIATION MEDICINE·Filed 2016·Granted Feb 11, 2020·1 cites·20 claims
- 0561US2025148471A1Security detection method and apparatus for decentralized finance of blockchainUNIV HAINAN·Filed 2024·Application pending·0 cites
- 0660US2025282826A1Preparation method, intermediates, and use of cyclic peptide toxin alpha-amanitin and/or amaninamideUNIV INNER MONGOLIA·Filed 2024·Application pending·0 cites
- 0759US12378877B2Method and device for identifying near-bit lithology based on intelligent voiceprint identificationINST GEOLOGY & GEOPHYSICS CAS·Filed 2023·Granted Aug 5, 2025·0 cites·9 claims
- 0854US12130397B2Seismic acquisition system based on frequency domain expansion mems sensorINST GEOLOGY & GEOPHYSICS CAS·Filed 2022·Granted Oct 29, 2024·0 cites·15 claims
- 0944US11342716B2Shielding net and connector using sameAVIC JONHON OPTRONIC TECH CO LTD·Filed 2019·Granted May 24, 2022·0 cites·9 claims
- 1044US2022155475A1Irregular optimized acquisition method, device, apparatus and medium for seismic dataINST OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES IGGCAS·Filed 2020·Application pending·0 cites
- 1136US10643862B2System-level packaging method and packaging system based on 3D printingINST GEOLOGY & GEOPHYSICS CAS·Filed 2018·Granted May 5, 2020·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →