Inventor · disambiguated record
Zongrong Liu
Also filed as: LIU ZONGRONG
19 granted patents·4 pending applications·227 citations·filing 2008–2019
93Inventor score
Top patents by PatentIndex Score
23 records- 0198US8288204B1Methods for fabricating components with precise dimension controlWANG LEI·Filed 2011·Granted Oct 16, 2012·151 cites·21 claims
- 0294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0388US10197733B2Edge coupling device fabricationFUTUREWEI TECHNOLOGIES INC·Filed 2017·Granted Feb 5, 2019·6 cites·20 claims
- 0487US8518748B1Method and system for providing a laser submount for an energy assisted magnetic recording headWANG LEI·Filed 2011·Granted Aug 27, 2013·8 cites·21 claims
- 0583US9703039B2Edge coupling device fabricationFUTUREWEI TECHNOLOGIES INC·Filed 2015·Granted Jul 11, 2017·4 cites·17 claims
- 0683US9632281B2Free space grating couplerFUTUREWEI TECHNOLOGIES INC·Filed 2014·Granted Apr 25, 2017·5 cites·5 claims
- 0783US9159345B1Micrometer scale componentsWESTERN DIGITAL FREMONT LLC·Filed 2014·Granted Oct 13, 2015·1 cites·4 claims
- 0879US9933570B2Integration of V-grooves on silicon-on-insulator (SOI) platform for direct fiber couplingFUTUREWEI TECHNOLOGIES INC·Filed 2016·Granted Apr 3, 2018·3 cites·19 claims
- 0973US9231361B2Tunable laser with high thermal wavelength tuning efficiencyFUTUREWEI TECHNOLOGIES INC·Filed 2014·Granted Jan 5, 2016·2 cites·21 claims
- 1071US9293694B2Magnetoresistive random access memory cell with independently operating read and write componentsYI GE·Filed 2011·Granted Mar 22, 2016·2 cites·20 claims
- 1170US10641966B2Free space grating couplerFUTUREWEI TECHNOLOGIES INC·Filed 2017·Granted May 5, 2020·1 cites·20 claims
- 1270US9672847B2Micrometer scale componentsWESTERN DIGITAL (FREMONT) LLC·Filed 2015·Granted Jun 6, 2017·0 cites·5 claims
- 1370US9012265B2Magnet assisted alignment method for wafer bonding and wafer level chip scale packagingYI GE·Filed 2012·Granted Apr 21, 2015·3 cites·19 claims
- 1468US8997832B1Method of fabricating micrometer scale componentsLIU ZONGRONG·Filed 2010·Granted Apr 7, 2015·2 cites·9 claims
- 1567US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 1654US8860216B1Method and system for providing a laser submount for an energy assisted magnetic recording headWESTERN DIGITAL FREMONT LLC·Filed 2013·Granted Oct 14, 2014·0 cites·3 claims
- 1752US10539744B2Gapless optical mode converterFUTUREWEI TECHNOLOGIES INC·Filed 2017·Granted Jan 21, 2020·0 cites·8 claims
- 1852US9577408B2Tunable laser with high thermal wavelength tuning efficiencyFUTUREWEI TECHNOLOGIES INC·Filed 2015·Granted Feb 21, 2017·0 cites·22 claims
- 1950US11282722B2Chip front surface touchless pick and place tool or flip chip bonderTANG YUNJUN·Filed 2019·Granted Mar 22, 2022·0 cites·19 claims
- 2048US2013307097A1Magnetoresistive random access memory cell designYI GE·Filed 2012·Application pending·0 cites
- 2142US2021005572A1Chip front surface touchless flip chip bondersLI DONG·Filed 2019·Application pending·0 cites
- 2240US2020382092A1Methods of making acoustic wave devicesLI DONG·Filed 2019·Application pending·0 cites
- 2334US2013270661A1Magnetoresistive random access memory cell designYI GE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →