Inventor · disambiguated record
Zong-En Wu
Also filed as: Wu zong-en
1 granted patent·2 pending applications·0 citations·filing 2018–2023
5Inventor score
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3 records- 0143US12431382B2Integrated wafer debonding and cleaning apparatus and debonding and cleaning methodGRAND PROCESS TECH CORPORATION·Filed 2023·Granted Sep 30, 2025·0 cites·16 claims
- 0238US2020161125A1Cleaning apparatus and method for chip-stacked structureGRAND PROCESS TECH CORPORATION·Filed 2019·Application pending·0 cites
- 0330US2019348304A1Cleaning apparatus and method for chip-stacked structureGRAND PLASTIC TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →