Inventor · disambiguated record
Zuoguo Wu
Also filed as: WU ZUOGUO · WU ZUOGUO J
57 granted patents·17 pending applications·161 citations·filing 2004–2025
98Inventor score
Top patents by PatentIndex Score
74 records- 0196US10552253B2Multichip package link error detectionINTEL CORP·Filed 2015·Granted Feb 4, 2020·15 cites·20 claims
- 0295US10552357B2Multichip package linkINTEL CORP·Filed 2017·Granted Feb 4, 2020·14 cites·25 claims
- 0392US11061761B2Multichip package link error detectionINTEL CORP·Filed 2020·Granted Jul 13, 2021·3 cites·26 claims
- 0492US9692402B2Method, apparatus, system for centering in a high performance interconnectINTEL CORP·Filed 2014·Granted Jun 27, 2017·10 cites·23 claims
- 0591US12332826B2Die-to-die interconnectINTEL CORP·Filed 2022·Granted Jun 17, 2025·2 cites·20 claims
- 0690US10073808B2Multichip package linkINTEL CORP·Filed 2013·Granted Sep 11, 2018·11 cites·20 claims
- 0789US11797378B2Multichip package link error detectionINTEL CORP·Filed 2022·Granted Oct 24, 2023·1 cites·20 claims
- 0889US11307928B2Multichip package link error detectionINTEL CORP·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 0989US9946676B2Multichip package linkINTEL CORP·Filed 2015·Granted Apr 17, 2018·8 cites·25 claims
- 1088US11599497B2High performance interconnectINTEL CORP·Filed 2020·Granted Mar 7, 2023·2 cites·22 claims
- 1187US12481614B2Standard interfaces for die to die (D2D) interconnect stacksINTEL CORP·Filed 2022·Granted Nov 25, 2025·1 cites·20 claims
- 1287US12353305B2Compliance and debug testing of a die-to-die interconnectINTEL CORP·Filed 2022·Granted Jul 8, 2025·1 cites·20 claims
- 1387US2025341570A1Skew detection and compensation for high speed i/o linksSK HYNIX NAND PRODUCT SOLUTIONS CORP DBA SOLIDIGM·Filed 2025·Application pending·0 cites
- 1486US7495491B2Inverter based duty cycle correction apparatuses and systemsINTEL CORP·Filed 2007·Granted Feb 24, 2009·14 cites·15 claims
- 1584US11450613B2Integrated circuit package with test circuitry for testing a channel between diesINTEL CORP·Filed 2018·Granted Sep 20, 2022·4 cites·15 claims
- 1683US12386768B2Extending multichip package link off packageINTEL CORP·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1783US11043965B2PCI express enhancementsINTEL CORP·Filed 2017·Granted Jun 22, 2021·3 cites·20 claims
- 1883US10050623B2High performance repeaterINTEL CORP·Filed 2015·Granted Aug 14, 2018·5 cites·24 claims
- 1981US10678736B2Extending multichip package link off packageINTEL CORP·Filed 2015·Granted Jun 9, 2020·2 cites·11 claims
- 2080US10789201B2High performance interconnectINTEL CORP·Filed 2017·Granted Sep 29, 2020·3 cites·19 claims
- 2178US9444551B2High performance optical repeaterINTEL CORP·Filed 2014·Granted Sep 13, 2016·4 cites·19 claims
- 2278US7579905B2Reduced jitter amplification methods and apparatusesINTEL CORP·Filed 2007·Granted Aug 25, 2009·10 cites·14 claims
- 2377US12117960B2Approximate data bus inversion technique for latency sensitive applicationsINTEL CORP·Filed 2020·Granted Oct 15, 2024·1 cites·20 claims
- 2476US11003610B2Multichip package linkINTEL CORP·Filed 2020·Granted May 11, 2021·1 cites·20 claims
- 2576US2023073807A1Extending multichip package link off packageINTEL CORP·Filed 2022·Application pending·0 cites
- 2674US2025093413A1Near field wireless communication system for mother to package and package to package sideband digital communicationINTEL CORP·Filed 2024·Application pending·0 cites
- 2773US11386033B2Extending multichip package link off packageINTEL CORP·Filed 2020·Granted Jul 12, 2022·0 cites·22 claims
- 2872US12372574B2Skew detection and compensation for high speed I/O linksINTEL CORP·Filed 2021·Granted Jul 29, 2025·0 cites·17 claims
- 2972US11632130B2PCI express enhancementsINTEL CORP·Filed 2022·Granted Apr 18, 2023·0 cites·23 claims
- 3071US11113225B2Extending multichip package link off packageINTEL CORP·Filed 2020·Granted Sep 7, 2021·0 cites·9 claims
- 3171US9484888B2Linear resistor with high resolution and bandwidthINTEL CORP·Filed 2012·Granted Nov 1, 2016·4 cites·15 claims
- 3271US7102381B2Adaptive termination for optimum signal detectionINTEL CORP·Filed 2004·Granted Sep 5, 2006·15 cites·29 claims
- 3370US7495489B2Frequency multiplying delay-locked loopINTEL CORP·Filed 2006·Granted Feb 24, 2009·7 cites·25 claims
- 3469US12505065B2On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHYINTEL CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 3569US9536863B2Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfacesHINCK TODD A·Filed 2011·Granted Jan 3, 2017·4 cites·16 claims
- 3667US11116072B2Discrete circuit having cross-talk noise cancellation circuitry and method thereofINTEL CORP·Filed 2017·Granted Sep 7, 2021·1 cites·19 claims
- 3767US7663442B2Data receiver including a transconductance amplifierINTEL CORP·Filed 2005·Granted Feb 16, 2010·6 cites·16 claims
- 3866US9337939B2Optical IO interconnect having a WDM architecture and CDR clock sharing receiverINTEL CORP·Filed 2012·Granted May 10, 2016·2 cites·24 claims
- 3965US2025158738A1Characterizing and margining multi-voltage signal encoding for interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 4063US11283466B2PCI express enhancementsINTEL CORP·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 4163US9965370B2Automated detection of high performance interconnect couplingINTEL CORP·Filed 2015·Granted May 8, 2018·1 cites·21 claims
- 4261US12499019B2Retimers to extend a die-to-die interconnectINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 4361US12196807B2Near field wireless communication system for mother to package and package to package sideband digital communicationINTEL CORP·Filed 2020·Granted Jan 14, 2025·0 cites·18 claims
- 4461US10908206B2Characterization of transmission mediaINTEL CORP·Filed 2016·Granted Feb 2, 2021·1 cites·25 claims
- 4561US10461805B2Valid lane trainingINTEL CORP·Filed 2015·Granted Oct 29, 2019·1 cites·20 claims
- 4661US2022011849A1Alternate physical layer power modeINTEL CORP·Filed 2021·Application pending·0 cites
- 4760US12362306B2Clock-gating in die-to-die (D2D) interconnectsINTEL CORP·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 4859US8143911B2Input/output driver swing control and supply noise rejectionWU ZUOGUO·Filed 2008·Granted Mar 27, 2012·2 cites·20 claims
- 4958US12468597B2Valid signal for latency sensitive die-to-die (D2D) interconnectsINTEL CORP·Filed 2022·Granted Nov 11, 2025·0 cites·21 claims
- 5057US10560081B2Method, apparatus, system for centering in a high performance interconnectINTEL CORP·Filed 2017·Granted Feb 11, 2020·0 cites·21 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →