Inventor · disambiguated record
Zvi Kotler
Also filed as: KOTLER ZVI
37 granted patents·11 pending applications·488 citations·filing 1997–2021
97Inventor score
Top patents by PatentIndex Score
48 records- 0198US9925797B2Lift printing systemORBOTECH LTD·Filed 2015·Granted Mar 27, 2018·18 cites·26 claims
- 0297US10471538B2Control of lift ejection angleORBOTECH LTD·Filed 2016·Granted Nov 12, 2019·10 cites·34 claims
- 0396US10633758B2Printing of three-dimensional metal structures with a sacrificial supportORBOTECH LTD·Filed 2016·Granted Apr 28, 2020·7 cites·28 claims
- 0493US10193004B2LIFT printing of conductive traces onto a semiconductor substrateORBOTECH LTD·Filed 2015·Granted Jan 29, 2019·8 cites·24 claims
- 0588US10688692B2Control of surface properties of printed three-dimensional structuresORBOTECH LTD·Filed 2016·Granted Jun 23, 2020·5 cites·26 claims
- 0688US6809290B2Laser energy delivery system outputting beams having a selectable energyORBOTECH LTD·Filed 2002·Granted Oct 26, 2004·24 cites·150 claims
- 0787US7078650B2Micro-machining employing multiple independently focused and independently steered beamsORBOTECH LTD·Filed 2003·Granted Jul 18, 2006·27 cites·26 claims
- 0885US10629442B2Lift printing of multi-composition material structuresORBOTECH LTD·Filed 2014·Granted Apr 21, 2020·6 cites·29 claims
- 0983US10015887B2Two-step, direct-write laser metallizationORBOTECH LTD·Filed 2014·Granted Jul 3, 2018·4 cites·25 claims
- 1082US7521651B2Multiple beam micro-machining system and methodORBOTECH LTD·Filed 2003·Granted Apr 21, 2009·18 cites·10 claims
- 1182US7176409B2Multiple beam micromachining system for removing at least two different layers of a substrateORBOTECH LTD·Filed 2002·Granted Feb 13, 2007·17 cites·25 claims
- 1282US6756563B2System and method for forming holes in substrates containing glassORBOTECH LTD·Filed 2002·Granted Jun 29, 2004·25 cites·12 claims
- 1382US6521136B1Method for making three-dimensional photonic band-gap crystalsISRAEL ATOMIC ENERGY COMM·Filed 2000·Granted Feb 18, 2003·37 cites·20 claims
- 1480US8395083B2Multiple beam drilling systemNAVEH BENNY·Filed 2009·Granted Mar 12, 2013·11 cites·11 claims
- 1578US7206120B2Dynamic beam splitter outputting a selectable number of beamsORBTECH LTD·Filed 2003·Granted Apr 17, 2007·17 cites·18 claims
- 1677US6738653B1Metabolism monitoring of body organsISRAEL ATOMIC ENERGY COMM·Filed 2000·Granted May 18, 2004·100 cites·55 claims
- 1774US7947922B2Multiple beam micro-machining system and methodORBOTECH LTD·Filed 2009·Granted May 24, 2011·2 cites·15 claims
- 1873US10451953B2Acousto-optic deflector with multiple output beamsORBOTECH LTD·Filed 2015·Granted Oct 22, 2019·1 cites·13 claims
- 1969US11409184B2Acousto-optic deflector with multiple output beamsORBOTECH LTD·Filed 2019·Granted Aug 9, 2022·0 cites·6 claims
- 2069US6815694B2Apparatus and method for probing light absorbing agents in biological tissuesISRAEL ATOMIC ENERGY COMM·Filed 2001·Granted Nov 9, 2004·53 cites·26 claims
- 2168US11464114B2System producing a conductive path on a substrateORBOTECH LTD·Filed 2021·Granted Oct 4, 2022·0 cites·9 claims
- 2267US8390795B2Multiple mirror calibration systemKOTLER ZVI·Filed 2009·Granted Mar 5, 2013·4 cites·14 claims
- 2367US7945087B2Alignment of printed circuit board targetsORBOTECH LTD·Filed 2007·Granted May 17, 2011·3 cites·46 claims
- 2465US6957096B2Method and apparatus for imaging absorbing objects in a scattering mediumISRAEL ATOMIC ENERGY COMM·Filed 2002·Granted Oct 18, 2005·45 cites·28 claims
- 2565US2020093001A1Method producing a conductive path on a substrateORBOTECH LTD·Filed 2019·Application pending·0 cites
- 2664US7642484B2Multiple beam micro-machining system and methodORBOTECH LTD·Filed 2002·Granted Jan 5, 2010·6 cites·59 claims
- 2762US7629555B2Multiple beam micro-machining system and methodORBOTECH LTD·Filed 2003·Granted Dec 8, 2009·5 cites·27 claims
- 2861US6911620B2System and method for unveiling targets embedded in a multi-layered electrical circuitORBOTECH LTD·Filed 2002·Granted Jun 28, 2005·10 cites·9 claims
- 2960US11271119B2LIFT printing of conductive traces onto a semiconductor substrateORBOTECH LTD·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
- 3060US10537027B2Method producing a conductive path on a substrateORBOTECH LTD·Filed 2013·Granted Jan 14, 2020·0 cites·11 claims
- 3155US5877825AMethod and device including electro-optical shutter for protection from pulsed radiationISRAEL ATOMIC ENERGY COMM·Filed 1997·Granted Mar 2, 1999·23 cites·21 claims
- 3252US7633036B2Micro-machining system employing a two stage beam steering mechanismORBOTECH LTD·Filed 2002·Granted Dec 15, 2009·2 cites·60 claims
- 3352US2006213885A1Micro-machining employing multiple independently focused and independently steered beamsORBOTECH LTD·Filed 2006·Application pending·0 cites
- 3452US2006146395A1Micro-machining system employing a two stage beam steering mechanismORBOTECH LTD·Filed 2006·Application pending·0 cites
- 3550US2017306495A1Angled lift jettingORBOTECH LTD·Filed 2017·Application pending·0 cites
- 3648US11627667B2High-resolution solderingORBOTECH LTD·Filed 2021·Granted Apr 11, 2023·0 cites·29 claims
- 3744US2021157238A1Methods and Systems for Producing Three-Dimensional Electronic ProductsORBOTECH LTD·Filed 2020·Application pending·0 cites
- 3843US12162294B2Lift printing using thin donor foilsORBOTECH LTD·Filed 2020·Granted Dec 10, 2024·0 cites·23 claims
- 3943US2017189995A1Printing of 3d structures by laser-induced forward transferORBOTECH LTD·Filed 2015·Application pending·0 cites
- 4041US12204228B2High-speed dynamic beam shapingORBOTECH LTD·Filed 2020·Granted Jan 21, 2025·0 cites·29 claims
- 4140US12042984B2Hybrid, multi-material 3D printingORBOTECH LTD·Filed 2017·Granted Jul 23, 2024·0 cites·6 claims
- 4240US2022347778A1Laser Printing of Solder PastesORBOTECH LTD·Filed 2021·Application pending·0 cites
- 4338US10622244B2Pulsed-mode direct-write laser metallizationORBOTECH LTD·Filed 2015·Granted Apr 14, 2020·0 cites·38 claims
- 4438US2023422402A1Lift Printing of Fine Metal LinesORBOTECH LTD·Filed 2021·Application pending·0 cites
- 4537US2011278269A1Method and system for electrical circuit repairGOLD URI·Filed 2010·Application pending·0 cites
- 4636US11881466B2Electrical interconnection of circuit elements on a substrate without prior patterningORBOTECH LTD·Filed 2018·Granted Jan 23, 2024·0 cites·20 claims
- 4735US2024222302A1Repair of solder bumpsORBOTECH LTD·Filed 2021·Application pending·0 cites
- 4829US2018090314A1Methods and Apparatus for Printing High-Viscosity MaterialsORBOTECH LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →