Inventor · disambiguated record

Richard Kapp

Also filed as: KAPP RICHARD

1 granted patent·6 citations·filing 1989–1989

27Inventor score

Technology areasH10W

Files withITT IND GMBH DEUTSCHE1

Top patents by PatentIndex Score

1 record

0122US5083193ASemiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facilityITT IND GMBH DEUTSCHE·Filed 1989·Granted Jan 21, 1992·6 cites·7 claims

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