Inventor · name-matched record

BAEK JONGHWAN

1 granted patent·1 pending application·0 citations·filing 2022–2025

9Inventor score

Technology areasH10W

Files withSEMICONDUCTOR COMPONENTS IND LLC2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0161US2026052989A1Mechanisms for dual coupling a semiconductor package assembly to a componentSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
0257US12593736B2Power module package with stacked direct bonded metal substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 31, 2026·0 cites·19 claims

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Identity basis: exact name match across USPTO filings. How scoring works →