Inventor · name-matched record
BAEK SEUNGDUK
1 granted patent·5 pending applications·0 citations·filing 2022–2025
5Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0180US2026011624A1Semiconductor package with bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0262US2026052985A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0361US2026068741A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0458US2026047483A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0556US12525559B2Semiconductor packages including directly bonded padsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 0652US2026068740A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →