Inventor · name-matched record
BHUSHAN BHARAT
0 granted patents·9 pending applications·0 citations·filing 2025–2025
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0191US2026041014A1Semiconductor assemblies with hybrid fanouts and associated methods and systemsLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0283US2026018560A1Semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0369US2026041008A1Logic-uppermost semiconductor device assemblies with reconstituted wafers and multi-reticle dies coupled by reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0469US2026040929A1Semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0569US2026040977A1Panel-level formation of logic-uppermost semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0669US2026040583A1Logic-uppermost semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0761US2026040917A1Thermal structures for hybrid bondingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0860US2026011652A1Redundant bond pads in stacked semiconductor architecturesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0959US2026011701A1Bypass interconnections for stacked semiconductor systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →