Inventor · name-matched record
BRAUNISCH HENNING
5 granted patents·7 pending applications·0 citations·filing 2021–2024
58Inventor score
Files withINTEL CORP12
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
12 records- 0164US2026090470A1Photonic stacks for multi-tier photonic integrated circuit package assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 0263US2026082917A1Integration of self-assembly features with photonic circuitsINTEL CORP·Filed 2024·Application pending·0 cites
- 0362US2026096472A1Extended hybrid bonding with a photonic interfaceINTEL CORP·Filed 2024·Application pending·0 cites
- 0462US2026099012A1Hybrid-bonded ic die having topographic surface featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026086307A1Optical coupling using shifted out-of-plane light propagationINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2026093070A1Multi-layer integrated ring resonators and waveguide interconnect stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US2026086279A1Technologies for low-crosstalk multilayer waveguide stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0860US12519073B2Conformal power delivery structures of 3D stacked die assembliesINTEL CORP·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
- 0958US12581938B2Package architecture for quasi-monolithic chip with backside powerINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·15 claims
- 1058US12581968B2Package architecture of large dies using quasi-monolithic chip layersINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
- 1156US12520506B2In situ inductor structure in buildup power planesINTEL CORP·Filed 2021·Granted Jan 6, 2026·0 cites·21 claims
- 1253US12550768B2Conformal power delivery structures near high-speed signal tracesINTEL CORP·Filed 2021·Granted Feb 10, 2026·0 cites·24 claims
Join the waitlist — get patent alerts
Get an alert when BRAUNISCH HENNING files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →