Inventor · name-matched record
BRUN XAVIER FRANCOIS
3 granted patents·2 pending applications·0 citations·filing 2021–2024
40Inventor score
Files withINTEL CORP5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0163US2026068752A1Stacked semiconductor die architecture with dies stacked orthogonal to a base die or substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0261US2026076255A1Stacked semiconductor die architecture with redistribution layers on dies stacked orthogonal to a base die or substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0359US12538841B2Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0456US12581988B2Microelectronic assemblies with through die attach film connectionsINTEL CORP·Filed 2021·Granted Mar 17, 2026·0 cites·20 claims
- 0553US12557675B2Inorganic redistribution layer on organic substrate in integrated circuit packagesINTEL CORP·Filed 2021·Granted Feb 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →