Inventor · name-matched record
CHAN KUEI-LIN
1 granted patent·1 pending application·0 citations·filing 2023–2025
8Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0181US2026101684A1Wafer bonding method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0259US12575123B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →