Inventor · name-matched record
CHANG KUO-CHIN
6 granted patents·5 pending applications·0 citations·filing 2022–2025
65Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9TAIWAN SEMICONDUCTOR MFG COMPANY LIMITED1TAIWAN SEMICONDUCTOR MFG COMPANY LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0186US2026060095A1Mimcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0275US12550710B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0373US2026101742A1Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LIMITED·Filed 2025·Application pending·0 cites
- 0471US12568866B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 3, 2026·0 cites·20 claims
- 0563US12519055B2Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0662US12532738B2Chip package structure with heat conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·19 claims
- 0762US2026047435A1Thermal structures for semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0861US2026052983A1Heat dissipation structure for integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0958US2026101782A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 1057US12525556B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 1154US12581935B2Stacked via structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →