Inventor · name-matched record
CHEN CHUN-YI
2 granted patents·1 pending application·0 citations·filing 2021–2025
27Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0189US2026096373A1Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0281US12518980B2Semiconductor substrate bonding tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0348US12590410B2Embossable non-solvent PU sheet, a laminate and a synthetic leather comprising the sameBASF SE·Filed 2021·Granted Mar 31, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →