Inventor · name-matched record
CHEN HAN-DE
1 granted patent·1 pending application·0 citations·filing 2025–2025
13Inventor score
Technology areasH10P
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0181US2026101684A1Wafer bonding method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0273US12557612B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Granted Feb 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →