Inventor · name-matched record
CHEN LIANG CHIN
0 granted patents·2 pending applications·0 citations·filing 2025–2025
Files withGLOBALWAFERS CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0164US2026018407A1Methods for tunable dielectric thickness of a semiconductor substrate using back surface heatingGLOBALWAFERS CO LTD·Filed 2025·Application pending·0 cites
- 0259US2026015766A1Reaction apparatus and methods for depositing an epitaxial layer on a semiconductor structure with side injectionGLOBALWAFERS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →