Inventor · name-matched record
CHEN QIANWEN
0 granted patents·7 pending applications·0 citations·filing 2024–2024
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0164US2026101523A1Metal-insulator-metal capacitor with protection layerINT BUSINESS MACHINES CORPORATION·Filed 2024·Application pending·0 cites
- 0263US2026005141A1Optimized 3d integrated backside power delivery structureIBM·Filed 2024·Application pending·0 cites
- 0363US2026068574A1Optimized dicing street/kerf for chiplet applicationIBM·Filed 2024·Application pending·0 cites
- 0463US2026047484A13d chiplet integration technologyIBM·Filed 2024·Application pending·0 cites
- 0562US2026076185A1Backside dual dielectric fill for better thermal conductivityIBM·Filed 2024·Application pending·0 cites
- 0662US2026005119A1Coaxial through-insulator via (tiv) with lateral metal footing connection for chiplet power signal connectionIBM·Filed 2024·Application pending·0 cites
- 0759US2026093132A1Backside waveguide and modulator integration with deep viaIBM·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →