Inventor · name-matched record
CHEN TSUNG-YU
4 granted patents·6 pending applications·0 citations·filing 2021–2024
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0184US12550775B2Semiconductor package with stiffener structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0282US12538816B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0371US12550729B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 10, 2026·0 cites·20 claims
- 0464US2026090374A1Semiconductor package and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0564US2026082941A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0663US2026068671A1Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0762US2026005207A1Semiconductor package with adiabatic well structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0861US12538835B2Integrated chip package including a crack-resistant lid structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0961US2026068745A1Package structure including a package lid with a bottom lid portion and top lid portion and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1057US2026005100A1Semiconductor package with hotspot controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when CHEN TSUNG-YU files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →