Inventor · name-matched record
CHEN WEI-CHIH
5 granted patents·2 pending applications·1 citations·filing 2022–2025
63Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4CHEN WEI CHIH1TAIWAN SEMICONDUCTOR MFG COMPANY LTD1UNIV NAT TSING HUA1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0197US2026096447A1Die and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0295US2026101806A1Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0394US12538808B2Die and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·1 cites·20 claims
- 0485US12519024B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0566US12550778B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0659US12528115B2Installation tool for self-tapping rivet fastenerCHEN WEI CHIH·Filed 2023·Granted Jan 20, 2026·0 cites·6 claims
- 0744US12562535B2Method for detecting undesired connection on printed circuit boardUNIV NAT TSING HUA·Filed 2022·Granted Feb 24, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →