Inventor · name-matched record
CHEN XIANMING
6 granted patents·1 pending application·0 citations·filing 2022–2025
62Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0180US2026053071A1Embedded packaging structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0255US12532769B2Package substrate based on molding process and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·16 claims
- 0353US12599019B2Embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·8 claims
- 0453US12598991B2Liquid circulating cooling package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·8 claims
- 0553US12588543B2Embedded flip chip package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·8 claims
- 0652US12550774B2Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·11 claims
- 0751US12525394B2Embedded inductance structure and manufacturing method thereofZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2022·Granted Jan 13, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →