Inventor · name-matched record
CHEN YEN-MING
3 granted patents·9 pending applications·0 citations·filing 2021–2025
47Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
12 records- 0195US2026082676A1Methods of reducing parasitic capacitance in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12550697B2Different isolation liners for different type FinFETs and associated isolation feature fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0381US2026089997A1Epitaxial features of semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0469US12520560B2Selective gate air spacer formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0563US12568681B2Active region patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 3, 2026·0 cites·20 claims
- 0663US2026101714A1Stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 0763US2026068738A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0862US2026011681A1Holding head structure and manufacturing method of semiconductor structure using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0961US2026076256A1Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1061US2026047466A1Bonding apparatus and method of bonding semioconductor chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1161US2026082947A1Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1256US2026011630A1Stacked structures for semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →