Inventor · name-matched record
CHEN YENHENG
2 granted patents·2 pending applications·0 citations·filing 2023–2023
21Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0158US12588544B2Packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Granted Mar 24, 2026·0 cites·8 claims
- 0257US12525581B2Pop structure of three-dimensional fan-out memory and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Granted Jan 13, 2026·0 cites·4 claims
- 0357US2026082981A1Chip packaging structure and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0457US2026090379A1Chip packaging structure and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when CHEN YENHENG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →