Inventor · name-matched record
CHEN YIN-JU
4 granted patents·4 pending applications·0 citations·filing 2024–2025
51Inventor score
Files withAALTOSEMI INC8
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0173US2026059658A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0263US12550765B2Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·5 claims
- 0360US2026060106A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0457US12550796B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·10 claims
- 0556US12550767B2Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·2 claims
- 0655US12557664B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 17, 2026·0 cites·2 claims
- 0754US2026026362A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0853US2026053033A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →